| PART |
Description |
Maker |
| AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| POWERSO-10 |
10LEADS POWER SMALL OUTLINE PACKAGE
|
STMicroelectronics
|
| POWERSOP |
Power Small Outline Package,PowerSOP
|
Amkor Technology
|
| FPT-20P-M04 |
THIN SHRINK SMALL OUTLINE PACKAGE
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| AP9451GG |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2304AGN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP9451GG-HF AP9451GG-HF-14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2622GY-12 |
Low Gate Charge, Small Package Outline
|
Advanced Power Electron...
|
| AK18D300-TSOP AK14D300-TSOP AK20D300-TSOP |
Thin Small Outline Package TSOP DIP Adapters
|
ACCUTEK MICROCIRCUIT CORPORATION
ACCUTEK MICROCIRCUIT CORPOR...
ACCUTEK MICROCIRCUIT CO...
|
| LC33832M-70 LC33832P-70 LC33832M-10 LC33832PL-10 L |
Small outline package version of the LC33832SL
x8 Pseudo-Static RAM
|
Sanyo Semiconductor
|
| SOT765-1 |
plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| MT2LDT432HG-6X MT2LDT432HG-5X MT4LDT832HG-5XS MT2L |
SMALL-OUTLINE DRAM MODULE 小外形DRAM模块
Silver Mica Capacitor; Capacitance:1200pF; Capacitance Tolerance: 5%; Series:CDV30; Voltage Rating:1500VDC; Capacitor Dielectric Material:Mica; Termination:Radial Leaded; Lead Pitch:11.1mm; Leaded Process Compatible:No RoHS Compliant: No 小外形DRAM模块
|
Micron Technology, Inc.
|
